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via grid - translation to English
TESSELLATION OF N-DIMENSIONAL EUCLIDEAN SPACE BY CONGRUENT PARALLELOTOPES
Cartesian grid; Rectilinear grid; Curvilinear grid; Structured grid; Rectangular grid
via grid
общая лексика
сетка размещения переходных отверстий
САПР печатных плат. Устанавливается кратной шагу сетки трассировки
Смотрите также
blind via
![Different types of vias:<br/> ('''1''') [[Through hole]].<br/> ('''2''') Blind via.<br/> ('''3''') Buried via.<br/>The gray and green layers are nonconducting, while the thin orange layers and red vias are conductive.](https://commons.wikimedia.org/wiki/Special:FilePath/Via Types.svg?width=200 "Different types of vias:<br/> ('''1''') [[Through hole]].<br/> ('''2''') Blind via.<br/> ('''3''') Buried via.<br/>The gray and green layers are nonconducting, while the thin orange layers and red vias are conductive.")
CONNECTION BETWEEN LAYERS IN AN ELECTRONIC CIRCUIT
Blind via; Thermal via; Castellated Hole; Via hole; Vertical interconnect access; Vertical Interconnect Access; VIA (electronics); Buried via; Deep vertical interconnect access; DVIA (electronics); Castellated hole; Plugged via; Stacked via; Staggered via; Filled via; Capped via; Tented via; Via-hole; Non-through via; Non-thru via; Non Through Via; Through Via; Through via; Non-through via hole; Non-thru via hole; Through via hole; Via-in-pad; Via plugging; Via tenting; Via filling; Tented & covered via; Tented and covered via; Covered via; Plugged buried via; Plugged & covered via; Plugged and covered via; Filled & covered via; Filled and covered via; Filled & capped via; Filled and capped via; Microvia filling; Filled microvia; Micro-via filling; Filled micro-via; Via capping; Via cap; Via fill; Via plug; Copper capped via; Blind micro via; Blind microvia; Through-glass via; Tenting via; LPI tenting; Liquid photoimageable solder mask tenting; Tenting (via); PCB via tenting; Tent a via; Tenting a via; PCB Via; Covered annular ring; Type I via; IPC type I via; IPC 4761 type I via; IPC 4761 type I; IPC 4761 Type I; Type II via; IPC type II via; IPC 4761 type II via; IPC 4761 type II; IPC 4761 Type II; Type III via; IPC type III via; IPC 4761 type III via; IPC 4761 type III; IPC 4761 Type III; Type III-a via; IPC type III-a via; IPC 4761 type III-a via; IPC 4761 type III-a; IPC 4761 Type III-a; Type III-b via; IPC type III-b via; IPC 4761 type III-b via; IPC 4761 type III-b; IPC 4761 Type III-b; Type IV via; IPC type IV via; IPC 4761 type IV via; IPC 4761 type IV; IPC 4761 Type IV; Type IV-a via; IPC type IV-a via; IPC 4761 type IV-a via; IPC 4761 type IV-a; IPC 4761 Type IV-a; Type IV-b via; IPC type IV-b via; IPC 4761 type IV-b via; IPC 4761 type IV-b; IPC 4761 Type IV-b; Type V via; IPC type V via; IPC 4761 type V via; IPC 4761 type V; IPC 4761 Type V; Type VI via; IPC type VI via; IPC 4761 type VI via; IPC 4761 type VI; IPC 4761 Type VI; Type VI-a via; IPC type VI-a via; IPC 4761 type VI-a via; IPC 4761 type VI-a; IPC 4761 Type VI-a; Type VI-b via; IPC type VI-b via; IPC 4761 type VI-b via; IPC 4761 type VI-b; IPC 4761 Type VI-b; Type VII via; IPC type VII via; IPC 4761 type VII via; IPC 4761 type VII; IPC 4761 Type VII; IPC 4761; Padstack; Pad stack; Via stack; Viastack; Thermovia
общая лексика
глухое переходное отверстие
в САПР электроники - несквозное переходное отверстие, которое достигает только одного внешнего слоя печатной платы
Смотрите также
through via
CONNECTION BETWEEN LAYERS IN AN ELECTRONIC CIRCUIT
Blind via; Thermal via; Castellated Hole; Via hole; Vertical interconnect access; Vertical Interconnect Access; VIA (electronics); Buried via; Deep vertical interconnect access; DVIA (electronics); Castellated hole; Plugged via; Stacked via; Staggered via; Filled via; Capped via; Tented via; Via-hole; Non-through via; Non-thru via; Non Through Via; Through Via; Through via; Non-through via hole; Non-thru via hole; Through via hole; Via-in-pad; Via plugging; Via tenting; Via filling; Tented & covered via; Tented and covered via; Covered via; Plugged buried via; Plugged & covered via; Plugged and covered via; Filled & covered via; Filled and covered via; Filled & capped via; Filled and capped via; Microvia filling; Filled microvia; Micro-via filling; Filled micro-via; Via capping; Via cap; Via fill; Via plug; Copper capped via; Blind micro via; Blind microvia; Through-glass via; Tenting via; LPI tenting; Liquid photoimageable solder mask tenting; Tenting (via); PCB via tenting; Tent a via; Tenting a via; PCB Via; Covered annular ring; Type I via; IPC type I via; IPC 4761 type I via; IPC 4761 type I; IPC 4761 Type I; Type II via; IPC type II via; IPC 4761 type II via; IPC 4761 type II; IPC 4761 Type II; Type III via; IPC type III via; IPC 4761 type III via; IPC 4761 type III; IPC 4761 Type III; Type III-a via; IPC type III-a via; IPC 4761 type III-a via; IPC 4761 type III-a; IPC 4761 Type III-a; Type III-b via; IPC type III-b via; IPC 4761 type III-b via; IPC 4761 type III-b; IPC 4761 Type III-b; Type IV via; IPC type IV via; IPC 4761 type IV via; IPC 4761 type IV; IPC 4761 Type IV; Type IV-a via; IPC type IV-a via; IPC 4761 type IV-a via; IPC 4761 type IV-a; IPC 4761 Type IV-a; Type IV-b via; IPC type IV-b via; IPC 4761 type IV-b via; IPC 4761 type IV-b; IPC 4761 Type IV-b; Type V via; IPC type V via; IPC 4761 type V via; IPC 4761 type V; IPC 4761 Type V; Type VI via; IPC type VI via; IPC 4761 type VI via; IPC 4761 type VI; IPC 4761 Type VI; Type VI-a via; IPC type VI-a via; IPC 4761 type VI-a via; IPC 4761 type VI-a; IPC 4761 Type VI-a; Type VI-b via; IPC type VI-b via; IPC 4761 type VI-b via; IPC 4761 type VI-b; IPC 4761 Type VI-b; Type VII via; IPC type VII via; IPC 4761 type VII via; IPC 4761 type VII; IPC 4761 Type VII; IPC 4761; Padstack; Pad stack; Via stack; Viastack; Thermovia
Definition
Аппиева дорога
(via Appia)
первая римская мощёная дорога (протяжённость ок. 350 км). Была проложена со стратегической целью при цензоре 312 до н. э. Аппии Клавдии (откуда её название) между Римом и Капуей; позже (в 244 до н. э.) доведена до Брундизия. А. д. была выложена из квадратных камней, по ней свободно могли проехать, не сталкиваясь, два воза. Вдоль А. д. (около Рима) сохранились памятники древнего некрополя (кладбища) языческого и раннехристианского времени.
Аппиева дорога.
Wikipedia
Regular grid
A regular grid is a tessellation of n-dimensional Euclidean space by congruent parallelotopes (e.g. bricks). Its opposite is irregular grid.
Grids of this type appear on graph paper and may be used in finite element analysis, finite volume methods, finite difference methods, and in general for discretization of parameter spaces. Since the derivatives of field variables can be conveniently expressed as finite differences, structured grids mainly appear in finite difference methods. Unstructured grids offer more flexibility than structured grids and hence are very useful in finite element and finite volume methods.
Each cell in the grid can be addressed by index (i, j) in two dimensions or (i, j, k) in three dimensions, and each vertex has coordinates in 2D or in 3D for some real numbers dx, dy, and dz representing the grid spacing.
